Bluetooth module eases headset design

Developers can easily implement a wireless solution into their product even with limited knowledge in Bluetooth and radio design

DataSoft has added WAH wireless audio headset firmware to its F2M03MLA multimedia Bluetooth module. The firmware is designed for easy connectivity to mobile phones incorporating the latest audio features in the Bluetooth technology. The following Bluetooth profiles are supported in WAH: A2DP, AVRCP, HFP, HSP and SPP where all profiles are acting as the headset side for communication with for example mobile phones.
The firmware can either be controlled individually with a button interface or from an external microcontroller using the UART interface with easy-to-use AT commands.

By using the F2M03MLA developers can easily implement a wireless solution into their product even with limited knowledge in Bluetooth and radio design.

The module, which contains this new firmware, is fully Bluetooth v.2.0 qualified and is certified according to CE and FCC.

To evaluate or upgrade F2M03MLA modules, the evaluation kit F2M03M-KIT is available and with the Flash Utility generic application software, the user can easily change and upgrade the firmware as well as changing advanced settings on the Bluetooth module.